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WLCSP
苏州晶方半导体科技股份有限公司
Classification
ProductPackaging & Test (OSAT)
Business Modelsubscriber only
Value ChainPackaging & Test
End MarketsAutomotive
Primary classification only. Subscribers see all tags on all four axes.
About
China Wafer Level CSP Co Ltd is a Chinese company engaged in offering semiconductor packages. It supplies wafer-level chip size packaging and test services to the RFID markets. The company also provides co-design and qualification services for new products. The company's product portfolio includes image sensor, biometric identification, ambient light, medical electronic and automotive sensor devices.
The full profile
Subscribers get the complete record for WLCSP: full 4-axis classification, all names and aliases (EN · 中文 · pinyin), key executives, products, listing details, and the company's latest news from the Semisino newswire.