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Sky Chip Interconnection Technology Co

天芯互联
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Classification

ProductPackaging & Test (OSAT)
Business ModelOSAT
Value ChainPackaging & Test
End MarketsAutomotive

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About

Sky Chip Interconnection Technology Co., Ltd. is a Chinese company specializing in advanced semiconductor packaging and testing solutions. Established in 2012, it operates manufacturing facilities in Shenzhen and Wuxi. The company offers services in wafer-level packaging (WLP), system-in-package (SiP), and fan-out panel-level packaging (FOPLP). Sky Chip provides comprehensive solutions including design, simulation, p…

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