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SJSemi
盛合晶微半导体
Classification
ProductPackaging & Test (OSAT)
Business ModelOSAT
Value ChainPackaging & Test
End MarketsAI / Data Center
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About
Provider of high-performance chip assembly, testing and packaging services intended to ensure the quality of finished semiconductors. The company's services offer 12-inch bumping and wafer testing services and focuses on the development of the 3D multi-die integration packaging business, enabling chip enterprises to produce semiconductors with high performance and speed, low power consumption and better computational…
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