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ICAT (IC Assembly & Test)

江苏爱矽半导体科技有限公司
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Headquarters
Xuzhou, Jiangsu

Classification

ProductPackaging & Test (OSAT)
Business ModelOSAT
Value ChainPackaging & Test
End MarketsAutomotive

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About

Provider of integrated circuit (IC) product packaging and testing designed for chip research and development enterprises. The company's product packaging forms include traditional wire-bonding packaging and high-end Structural insulated panels (SIP) system-in-package and wafer-level packaging, providing customers with high-quality products in the fields of smartphones, consumer electronics, security products, and aut…

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ICAT (IC Assembly & Test) (江苏爱矽半导体科技有限公司) — Semisino