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Guangxi Guixin Semiconductor Technology
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About
Guixin provides comprehensive services including packaging design, product development, and certification, covering the entire process from wafer probing and packaging to final testing. With deep technical expertise, Guixin supports a range of advanced technologies such as thinning and dicing for 6", 8", and 12" memory chips below 150μm, as well as packaging types like lead frame, Fan-out eWLB, WLCSP, Bump, PoP, fcBG…
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