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CCSC
中山芯承半导体有限公司
Classification
ProductMaterials
Business ModelMaterials Supplier
Value ChainMaterials Supply
End MarketsAI / Data Center
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About
Developer and manufacturer of integrated circuit packaging substrates intend to serve the semiconductor industry. The company adopts MSAP (modified semi-additive method), ETS (buried line technology) and SAP (semi-additive method) routes processing process to produce FCCSP (flip chip chip scale package), FC BGA (flip chip ball grid array) and other substrates, providing clients in smartphones, smart wear, data center…
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