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CASMEIT
江苏中科智芯集成科技有限公司
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End MarketsIoT / Edge
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About
Developer of wafer packaging solutions. The company focuses on the R&D and production of wafer-level fan-out packaging technology and customized design and products that are widely used on big data, wearable, mobile electronic device and communication products, enabling customers with reliable and personalized wafer packaging solutions.
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