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AiNSTEC
中科融合感知智能研究院（苏州工业园区）有限公司
Classification
ProductSensors
Business ModelFabless
Value ChainChip Design
End MarketsTelecom Infrastructure
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About
Developer and provider of "AI+3D" chip technology designed for 3d sensing. The company has developed MEMS sensor chip and low-power AI chip, enabling 3D-sensing devices with edge intelligence in the 5G era.
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