Trailing-edge capacity is where analog, power management, BCD, microcontroller and discrete power products are made, and it is the part of the foundry market where China has built the most. This atlas maps 306 fabs at 92 companies running 28nm and older processes, from TSMC and UMC to Texas Instruments and Analog Devices, and across the mainland from SMIC and Hua Hong to Nexchip, Silan and CR Micro. Capacity is nameplate wafers per month at native diameter, converted to 200mm equivalents by wafer area (150mm = 0.5625, 300mm = 2.25), the same convention SMIC and Hua Hong use for their own disclosures. Roughly half of the figures are company-disclosed at fab level; the rest are allocations from company totals or estimates, and each fab carries a confidence flag, so read the map as a shape rather than a ledger.